High-performance power cycling & transient thermal impedance measurement system
Built for speed, convenience and ease of use, the StructureScope system revolutionizes traditional transient thermal testing workflows. Go from being handed a DUT to obtaining a structure function in less than 10 minutes.
StructureScope's high-accuracy analog signal chain enables measuring next-generation packaging substrates with very short thermal time constants. Even diamond isn't a problem.
Experience it today!
StructureScope
Compact, high-performance system for transient thermal characterization. First class support for Si and SiC devices.
Next generation transient thermal characterization platform with expanded TSEP selection and support for GaN devices.
Qualification and failure analysis
For reliability and packaging teams at device, module and system manufacturers.
- Rth-jc for datasheets to JESD51-14
- Lifetime testing to AQG 324
- Root-cause analysis of package degradation
Research and teaching
For university groups working on devices, packaging materials and electro-thermal modeling.
- Compact thermal models for simulation
- Open data export and scripting
- Shared-facility scheduling and user accounts