StructureScope technical data
Values are for a single, standalone unit in the standard configuration.
Thermal characterisation
Device types and temperature-sensitive electrical parameters (TSEPs) supported for transient thermal impedance testing and power cycling.
| Parameter | Value |
|---|---|
| Supported device types | Si MOSFET, Si IGBT, SiC MOSFET |
| Supported TSEPs | Body diode Vf, VGS (sat), VGE (forward-active) |
VDS measurement
Specification for VDS sampling subsystem, used for when VDS is selected as the TSEP.
| Parameter | Value |
|---|---|
| Sampling rate | 1 MS/s |
| Input range | -5 V - +50 V |
| Resolution | 16 bits |
| Effective resolution | 153 μV/LSB (-5 V to 0 V), 1.53 mV/LSB (0 V to 50 V) |
| Bandwidth | 500 kHz |
| Settling time | ≤ 5 µs |
| Accuracy | TBD |
| Record length | Infinite |
| RMS noise (0.1 Hz - 500 kHz) | ≤ 75 µV |
| Peak-to-peak noise (0.1 Hz - 500 kHz) | ≤ 750 µV |
| Overload protection | Yes |
| 4-wire (Kelvin) sensing | Yes |
VGS measurement
Specification for VGS sampling subsystem, used for when VGS or VGE selected as the TSEP.
| Parameter | Value |
|---|---|
| Sampling rate | 100 kS/s |
| Input range | -10 V - +10 V |
| Resolution | 16 bits |
| Effective resolution | 305 μV/LSB |
| Bandwidth | 450 kHz |
| Settling time | ≤ 5 µs |
| Accuracy | TBD |
| Record length | Infinite |
| RMS noise (0.1 Hz - 450 kHz) | TBD |
| Peak-to-peak noise (0.1 Hz - 450 kHz) | TBD |
| Overload protection | Yes, up to ±60 V |
| 4-wire (Kelvin) sensing | No |
Thermocouple input
Specification for optional thermocouple input.
| Parameter | Value |
|---|---|
| Channels | 1 |
| Sampling rate | 32 S/s |
| Thermocouple type | T |
| Cold junction compensation | Yes |
| Resolution | 16 bits |
| Effective resolution | 0.2 °C/LSB |
| Accuracy | TBD |
| Record length | Infinite |
| RMS noise | TBD |
| Peak-to-peak noise | TBD |
| Overload protection | Yes |
Gate drive
Gate drive specifications for positive gate bias (used when heating, and for cases where VGS or VGE is selected as the TSEP) and negative gate bias (used in the cooling/measurement phase for when body diode Vf is selected as the TSEP).
| Parameter | Value |
|---|---|
| Output range | ±10 V |
| Negative voltage setpoint resolution | 12 bits |
| Negative voltage output accuracy | TBD |
| Positive to negative settling time | ≤ 5 µs (depending on load) |
| Output short circuit current | ±10 mA |
| Maximum short circuit duration | Infinite |
| Overvoltage protection | Yes, up to ±60 V |
Measurement current sink
Specifications for internal measurement current sink, used to forward bias the body diode in MOSFET DUTs when VDS is used as a TSEP.
| Parameter | Value |
|---|---|
| Range | 0 mA - 25 mA |
| Resolution | 12 bits |
| Effective resolution | 6.1 µA/LSB |
| Accuracy | TBD |
| Voltage range | -6 V - 55 V |
DUT heating
Specifications for heating phase in transient thermal impedance tests and power cycling.
| Parameter | Value |
|---|---|
| DUT heating power | 0 W - 137.5 W |
| Heating power setpoint resolution | 12 bits |
| Heating power accuracy | TBD |
| Protection | OVP, UVP, OCP |
System
Specifications for single standalone unit.
| Parameter | Value |
|---|---|
| Dimensions | 106 mm (W) x 40 mm (H) x 160 mm (D) |
| Main data interface | 100BASE-TX Fast Ethernet |
| Auxiliary data interface | RS232 (on GPIO port) |
| Main system power source | IEEE 802.3af Power over Ethernet (PoE) |
| Heating power source | 24 V - 55 V, Kycon KPPX-4P or equivalent |
| DUT connector | 6 pin Phoenix Contact terminal block, MSTB 2,5/ 6-STF-5,08 or equivalent |
| GPIO | 6 pins, 4 digital I/O, 2 digital I/O + analog inputs |
| Auxiliary voltage output (on GPIO port) | 12-bit, 0 V - 2.5 V, ±10 mA |
| System level galvanic isolation | Yes, provided heating power source is also galvanically isolated |
| Parameter | Value |
|---|---|
| Structure functions | Cumulative and differential |
| Thermal models | Cauer RC network |
| Zth evaluation | Rth-jc (TDIM), Rth-ja, Zth(t) |
| Degradation tracking | Cycle-by-cycle structure function extraction |
| TSEP characterization/K-factor calibration | Fully automated when paired with software controlled heater/manual |
| Automation | via Thermal Nodes software |
| Data export | All signals (VDS, VGS, thermocouple), cooling curve, Zth curve, structure functions, etc. All with optional downsampling. |
| Data export file format | CSV, HDF5 (compressed), proprietary zst compressed format |
| Image export file format | PNG |
Standards
Standards for which StructureScope can perform tests.
| Parameter | Value |
|---|---|
| Thermal characterization | JESD51-1, -14 |